Cooler Master Hyper 212X CPU Air Cooler

Key Features
Model: Hyper 212X
Cooler Type: Air Cooler
Fan Speed: 600-1700 RPM
Fan Air Flow: 21.2 – 54.6 CFM
Fan Air Pressure: 0.40 – 2.03 mmH2O

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Specification and Description

Specification

Key Features
Model Hyper 212X
Type Air Cooler
Fan Speed 600-1700 RPM ± 10%
Fan Airflow 21.2 – 54.6 CFM ± 10%
Noise 13 – 28.6 dBA
Air Pressure 0.40 – 2.03 mmH2O ± 10%
Connector 4-Pin (PWM)
Material HEAT SINK MATERIAL: Aluminum Fins, Copper (Heat Pipes)
Physical Specification
Dimension DIMENSIONS: 120 x 79 x 158 mm

FAN DIMENSIONS: 120 x 120 x 25 mm

HEAT SINK DIMENSIONS: 116 x 51 x 158 mm

Weight FAN WEIGHT: 166g

HEAT SINK WEIGHT: 492g

Supported Sockets
Intel LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150
AMD AM4, AM3+, AM3, AM2+, FM2+, FM2, FM1
Warranty Information
Warranty 01 Year

Description

Cooler Master Hyper 212X CPU Air Cooler 

The latest in the extremely popular Hyper 212 series, Cooler Master Hyper 212X is based on the same patented CDC Quad heat pipe array as the 212 EVO but features several improvements that boost performance and further reduce noise. Thanks to our brand-new Smart Engine and POM bearing, the 212X is incredibly durable and will virtually last a lifetime. Positioned in a 45-degree angle and surrounding the heat pipe, each fin-blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most next to the heat pipes. Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heat pipes. The combination of both of these patent technologies results in notably higher airflow over the heat pipes and the adjacent fin area, which ultimately reduces CPU temperatures. The specially designed X-Vents act similar to tiny airplane wings and prevent dead spots behind and between heat pipes. The combination of these patented technologies results in a notably higher airflow over the heat pipes and the adjacent fin area, ultimately reducing CPU temperatures. 4 Continuous Direct Contact Heat pipes create a gap-less contact surface for unmatched cooling efficiency. Aluminum Fin Array with Tunnel Effect layout creates micro vortices that boost the airflow and circulate it around the heat pipes. Fast and easy to install and extremely reliable, our famous X-Bracket mounting system is compatible with all current sockets.

 

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